Skip to content
Toggle navigation
BRANDS
Aegis
Hermetic Seal
Sealtron
SCP
PRODUCTS
Components
Hermetic Terminals and End Seals
Transistor Outlines
Interconnects
Hermetic Rectangular Connectors
Hermetic Circular Connectors
Custom Hermetic Circular Connectors
Hermetic Headers
High Pressure High Temperature Electrical Bulkheads
RF Connectors
Hermetic Packages
Machined Housings
Flatpacks
Metal Platforms
Power Surface Mounts
Ceramic Feedthroughs - HTCC
Package Solutions
Optical Windows | Lids and Covers
Subsea Connectivity
Subsea Connectors
Subsea Penetrators
Subsea Cable Assemblies
RESOURCES
FAQ
Choices in Electronic Packaging
Design Guidelines
Material Selection
Electronic Packaging Product Library of glass to metal seal
Terms Defined
Why Use Hermetic
Data Sheet Library
Patents
Product Data Sheets
Naval Reference Materials
Quality Certificates
Technical Papers
White Papers
Insider’s Guide to Customizing Hermetic Connectors for Defense and Aerospace Applications
The Connector Challenge | Buyer's Guide for Subsafe
RF Connector-Packaging Integration
Insider’s Guide to Purchasing Aerospace and Defense Hermetic Connectors
Videos
Product Videos
OUR BUSINESSES
SEALTRON
Hermetic Seal
AMETEK SCP
AMETEK Aegis
MARKETS
Aerospace
Defense
Space
Defense Navy
High Performance Electronics
Automotive
Energy
Medical Devices
Optical Communications
RF Microwave
LATEST NEWS
News At A Glance
Trade Shows
CONTACT
Contact Us
Locations
Manufacturer Sales Representatives
Distributors
Careers
Portal
CONTACT US
GET A QUOTE
Resources
FAQ
Choices in Electronic Packaging
Ceramic vs Glass Packages
Design Guidelines
Material Selection
Electronic Packaging Product Library of glass to metal seal
Terms Defined
Why Use Hermetic
Data Sheet Library
Patents
Product Data Sheets
Naval Reference Materials
Military Reference
AWG References
Contact Sizes
Quality Certificates
Technical Papers
White Papers
Insider’s Guide to Customizing Hermetic Connectors for Defense and Aerospace Applications
The Connector Challenge | Buyer's Guide for Subsafe
RF Connector-Packaging Integration
Insider’s Guide to Purchasing Aerospace and Defense Hermetic Connectors
Videos
Product Videos
AMETEK EIP
»
RESOURCES
»
Technical Papers
»
Technical Papers
Resources
Technical Papers from our top Engineers - AMETEK ECP
SMPx Series RF Connectors
Electronic Packaging
Craig Vieira
September 2016
S-Bend Ceramic Feedthrough for Enhanced RF Signal Performance
Prototype Test Update
Craig Vieira and Ken McGillivray
March 2016
Advanced Manufacturing Process for Cover Assemblies
Coining, Inc.
Vincent Boccio and Martin Oud
Jan 2016
Creative Adaptation of Interconnect Technology Across Industry Boundaries
AMETEK SCP, Inc.
Dave Jenkins and Richard Miller
Oct 2015
NDIA Technical Program - PBOF Sensor Cabling Systems
AMETEK SCP, Inc
Dave Jenkins
September 2014
New Technology for UDT 2014
AMETEK SCP, Inc.
Paula Christina
June 2014
HTCC Technology Design Guide and Applications
Electronic Packaging
Ken McGillivray
May 2014
Essential Design and Risk Management For A Next Generation Ocean Dry Mate Connector
AMETEK SCP, Inc.
Dave Jenkins, Matt Christiansen and Steve Thumbeck
September 2013
Au/Sn Solder Alloy and Its Applications in Electronics Packaging
Coining, Inc.
Tao Zhou, Tom Bobal, and Martin Oud
We are frequently asked to present at industry trade shows about our solutions. AMETEK ECP technical papers provide information on design, modeling, and performance from our top engineers..
To get the latest papers, please follow us on LinkedIn.
MacCMS
×