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AMETEK EIP
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Technical Papers
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Technical Papers
Resources
Technical Papers from our top Engineers - AMETEK ECP
SMPx Series RF Connectors
Electronic Packaging
Craig Vieira
September 2016
S-Bend Ceramic Feedthrough for Enhanced RF Signal Performance
Prototype Test Update
Craig Vieira and Ken McGillivray
March 2016
Advanced Manufacturing Process for Cover Assemblies
Coining, Inc.
Vincent Boccio and Martin Oud
Jan 2016
Creative Adaptation of Interconnect Technology Across Industry Boundaries
AMETEK SCP, Inc.
Dave Jenkins and Richard Miller
Oct 2015
NDIA Technical Program - PBOF Sensor Cabling Systems
AMETEK SCP, Inc
Dave Jenkins
September 2014
New Technology for UDT 2014
AMETEK SCP, Inc.
Paula Christina
June 2014
HTCC Technology Design Guide and Applications
Electronic Packaging
Ken McGillivray
May 2014
Essential Design and Risk Management For A Next Generation Ocean Dry Mate Connector
AMETEK SCP, Inc.
Dave Jenkins, Matt Christiansen and Steve Thumbeck
September 2013
Au/Sn Solder Alloy and Its Applications in Electronics Packaging
Coining, Inc.
Tao Zhou, Tom Bobal, and Martin Oud
We are frequently asked to present at industry trade shows about our solutions. AMETEK ECP technical papers provide information on design, modeling, and performance from our top engineers..
To get the latest papers, please follow us on LinkedIn.
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