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Hermetic Packages

What We Do:  Design and manufacturing glass-to-metal seal, ceramic-to-metal seals, and ceramic packages for devices needing protection from a host of environmental conditions.  An electronic package is a hermetic housing that protects delicate circuitry for high reliability applications.   Often the hermetic housing is the last assembly step before our customers ship their product.

Hermetic Packaging
  • CNC Machined Housings Electronic Packaging AMETEK ECP
    Machined Housings

    AMETEK has the engineering skills and the production capacity to solve any high reliability interconnection problem, utilizing glass-to-metal-sealing or molding technology using PEEK (polyether ether ketone) polymers and Viton® fluoroploymer elastomers.

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  • AMETEK Electronic Components and Packaging - Flatpacks
    Flatpacks

    AMETEK manufacturers hermetic microelectronic packages including a variety of flatpack packages. Our capabilities include special connectors, fiber optic ports, unusual lead forming, and brazing dissimilar metals

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  • AMETEK Electronic Components and Packaging Metal Platforms
    Metal Platforms

    AMETEK manufacturers hermetic microelectronic packages including a variety of metal platform packages. Most Platform Plug-ins are designed to accommodate the use of a domed cover or lid. Platform Plug-ins can have virtually any I/O configuration but are most commonly purchased in a grid pattern.

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  • AMETEK Electronic Components and Packaging Plug-Ins
    Plug-Ins

    AMETEK manufacturers hermetic microelectronic packages including a variety of plug in packages, where leads or I/O’s extend out the bottom of the enclosure

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  • AMETEK Electronic Components and Packaging Power Surface Mounts
    Power Surface Mounts

    AMETEK manufactures hermetic microelectronic packages including a variety of power surface mounts. Our patented power surface mountable design is a very low thermally resistive, highly efficient, small, hermetic, surface mountable package. The SMD line is ideally suited to house power Mosfets, single and center-tap power Shotky rectifiers, as well as adjustable and fixed voltage regulators.

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  • HTCC Circular Electronic Packaging AMETEK ECP High Temperature Cofired Ceramics General Ceramics
    Ceramic Feedthroughs - HTCC

    A high temperature co-fired ceramic package (HTCC) is a multilayered, sealed and highly reliable package created using layers of ceramic tape with thicknesses ranging from 5 to 25 millimeters, which are laminated together. The co-fired ceramic packages’ tape layers, consisting of 92 percent aluminum oxide ceramic, tungsten and molymanganese, have metalized circuit patterns. Conductive vias pierce the tape layers, forming electrical interconnects between circuits. The ceramic packages’ tape layers are laminated under pressure and the ceramic and metalization are co-sintered at 1600 degrees Celsius, creating a monolithic structure with a three dimensional wiring system.

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