Optical Communications

Market Applications

Optical Communications

Optical Communications for global broadband connectivity are pushing the boundaries of what is possible.

AMETEK ECP is the wold's largest supplier of Solder preforms. Whether you want Solder Preforms in standard shapes (examples include squares, rectangles, washers and discs, or special solutions, AMETEK delivers faster, more reliably, and cost effectively.

Used for attaching electronic circuitry, packaging electronic devices, providing good thermal and electrical conductivity, and providing an interface for electronic connections.

Coining wire and ribbon are widely used as electrical interconnect materials in manufacturing microelectronic devices. These products facilitate a bond between a chip and substrate or between two chips.

Bonding Wire

Coining wire and ribbon are widely used as electrical interconnect materials to facilitate a bond between a chip and substrate or between two chips.

OptoElectronic Housings

AMETEK has manufactured hundreds of thousands of optical modulators. Plus we invest in technologies to make it faster and more cost effectively.

Optical Windows

Optically clear, AR coated, or Sapphire windows which we hermetically solder to the lid

SMPx Series RF Connectors

Need faster and smaller?
SMPS is capable of frequencies up to 65 GHz

Data Sheets and Downloads

Optoelectronic Housing Shop Talk

AMETEK has an excellent reputation for manufacturing hermetic Optoelectronic Housings for the leading OEM manufacturers in the Optical Networking Telecommunications Industry.

S-Bend RF Connectors

Problem: Hermetic Packages for Telecommunication Applications Require Improved Signal Integrity>40 GHz
Solution: The S-Bend Design Eliminates the Requirement for Vias in the Signal Path

SMP RF Connectors

Higher density vs. traditional SMA
• Radial & Axial Misalignment Tolerant
• Customizable
– Body Length
– Pin Extension & termination
– Multiport Configurations

AMETEK Glass to Metal Seals (GTMS) and Ceramic to Metal Seals (CTMS) are used in several optical communication applications, including optical networking components and RF frequency test and measurement equipment among others. AMETEK’s ability to help customers develop products to meet demanding specifications allows AMETEK Inc. to win their confidence and develop long-term relationships. Additionally, AMETEK’s reputation for excellence in developing custom hermetic interconnect and thermal microelectronic packaging solutions creates opportunities to share expertise across various customer applications.

Our capabilities to serve this industry include:

Worldwide supplier to industrial, telecommunication and process control industry
Lean manufacturing implementation at all facilities
Temperature testing to 1000°F / 538°C
High current contacts using noble metals
High density contact patterns
Hard wired or mated pair design options
Reduced lead times for prototype requirements
Comprehensive design and testing capabilities
Total Vertical Integration
Machining capabilities
In-house plating
Manufacturing of both low pressure (TO style) and high pressure (stainless steel and titanium) headers
High reliability, hermetically sealed packages from standard outlines (transistor outline, dual in-line, plug-ins and flatpacks) to extremely sophisticated and complex custom configurations
In-house metal fabrication, stamping, grinding, punching
Component manufacturing including RF terminals, DC pin assemblies and SMA, SMP (GPO) and SSMP (GPPO) connectors
Dedicated brazing, sealing, and integration furnaces
In-house tool and die
Split frame manufacturing capabilities for larger, more complex assemblies
AMETEK Inc. is ISO9001:2000 (with AS9100A) Registered by NSF

Applications Include:

Test and Measurement Equipment (RF Frequency)
Satellites
Optical Networking Components

Markets

Optical Communications