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AMETEK ECP

AMETEK Interconnect Capabilities
Interconnect
AMETEK has the engineering skills and the production capacity to solve any high reliability interconnection problem. Manufacturing glass-to-metal-seals (GTMS), hermetic connectors to QPL and custom requirements, high pressure (HPHT) bulkhead connectors, very high temperature connectors, ruggedized connectors that combine glass seals and PEEK molding technology and subsea connectors.
Hermetic Packaging of AMETEK
Packaging
Hermetic microelectronic packaging, connectors, headers, and substrate solutions that utilize custom metal working capabilities as well an expertise in Glass-to-Metal Sealing (GTMS), Ceramic-to-Metal Sealing (CTMS), and High-Temperature Cofired Ceramic (HTCC).